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简体中文- Manufacturer：
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- CUI Devices (1)
- Ohmite (1)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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4 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
|
9
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
|
10
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Ohmite | HEATSINK BLACK A... |
|
35,000
In-stock
|
Details Buy Now |
