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简体中文- Manufacturer：
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- CTS Corporation (5)
- CUI Devices (1)
- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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17 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CTS Corporation | HEATSINK FORGED ... |
|
12,290
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK 29X12MM S... |
|
118
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 33.... |
|
1,194
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK 21X18MM F... |
|
98
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK 21X18MM S... |
|
99
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK 21X18MM D... |
|
97
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK 29X12MM F... |
|
85
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK 29X12MM D... |
|
88
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 30X30X19.5M... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 31X31X19.5M... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
|
1
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
0.000
|
35,000
In-stock
|
Details Buy Now |
