Русский язык
简体中文- Manufacturer：
-
- CUI Devices (1)
- Attachment Method：
-
- Material：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
3 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 40MM X 40... |
|
1,226
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 35 ... |
|
700
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 40X40X19.5M... |
|
35,000
In-stock
|
Details Buy Now |
