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简体中文- Manufacturer：
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- CUI Devices (1)
- Attachment Method：
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- Material：
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- Power Dissipation @ Temperature Rise：
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16 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
|
327
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | 1/2 BRICK HEATSINK... |
|
620
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
|
147
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45... |
|
901
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 300X... |
|
70
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 37.5 X 37.5... |
|
86
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X17.5M... |
|
100
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 50MM X 45... |
|
68
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK 23X21MM S... |
|
90
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK 23X21MM D... |
|
87
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK AL6063 1220... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 40 ... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 37.5X37.5X1... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK 23X21MM F... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 |
0.000
|
35,000
In-stock
|
Details Buy Now |
