Русский язык
简体中文- Manufacturer：
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- CUI Devices (2)
- Ohmite (1)
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 25 ... |
|
1,433
In-stock
|
Details Buy Now | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
|
221
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 27 ... |
|
239
In-stock
|
Details Buy Now |
