Русский язык
简体中文- Manufacturer：
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- CUI Devices (3)
- Malico Inc. (1)
- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Shape：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 3.6W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Malico Inc. | AL HEAT SINK 23X23X... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
TE Connectivity AMP Connectors | 30.5MM LOW P HS ASS... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
TE Connectivity AMP Connectors | 27MM LOW P HS ASSY... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
TE Connectivity AMP Connectors | 30.5MM HS ASSY ULTE... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
TE Connectivity AMP Connectors | 29MM PIN FIN HS AS... |
0.000
|
35,000
In-stock
|
Details Buy Now |
