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简体中文- Manufacturer：
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- CUI Devices (1)
- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK TO-220 VR... |
|
4,856
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
|
300
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK FOR TO21... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK FOR TO21... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/S... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK TO-220 W/S... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK TO-220 VE... |
0.000
|
35,000
In-stock
|
Details Buy Now |
