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简体中文- Manufacturer：
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- CUI Devices (1)
- Attachment Method：
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- Material：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Natural：
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- Type：
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16 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
|
31,979
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
|
4,538
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
|
143
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 21MM X 21... |
|
100
In-stock
|
Details Buy Now | ||
|
|
TE Connectivity AMP Connectors | HEAT SINK BGA 21MM... |
|
9
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 21X21X24.5M... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X24.5M... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 32.5 X 32.5... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
|
3
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
TE Connectivity AMP Connectors | HEAT SINK BGA 21MM... |
|
35,000
In-stock
|
Details Buy Now |
