Manufacturer:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Price Stock Action
HSB18-232310 CUI Devices
HEAT SINK, BGA, 23 ...
$0.0208
RFQ
5,589
In-stock
Details Buy Now
960-19-15-F-AB-0 Wakefield Thermal
HEATSINK 19X15MM F...
$0.0972
RFQ
225
In-stock
Details Buy Now
960-19-15-S-AB-0 Wakefield Thermal
HEATSINK 19X15MM S...
$0.0972
RFQ
89
In-stock
Details Buy Now
960-19-15-D-AB-0 Wakefield Thermal
HEATSINK 19X15MM D...
$0.0972
RFQ
35,000
In-stock
Details Buy Now
960-23-12-F-AB-0 Wakefield Thermal
HEATSINK 23X12MM F...
$0.0998
RFQ
35,000
In-stock
Details Buy Now
960-23-12-D-AB-0 Wakefield Thermal
HEATSINK 23X12MM D...
$0.0998
RFQ
35,000
In-stock
Details Buy Now
960-23-12-S-AB-0 Wakefield Thermal
HEATSINK 23X12MM S...
$0.0787
RFQ
35,000
In-stock
Details Buy Now
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