Русский язык
简体中文- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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2 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, STAMPI... |
|
2,215
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
3,230
In-stock
|
Details Buy Now |
