Русский язык
简体中文- Manufacturer：
-
- CUI Devices (1)
- Attachment Method：
-
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
2 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-218/TO... |
|
1,341
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
35,000
In-stock
|
Details Buy Now |
