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简体中文- Manufacturer：
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- CUI Devices (1)
- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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11 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
|
620
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
|
541
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 19MM X 19... |
|
38
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
|
93
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
|
34
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 21MM X 21... |
|
14
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 31MM X 31... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 31X31X9.5M... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 19X19X14.5M... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 21X21X14.5M... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
35,000
In-stock
|
Details Buy Now |
