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简体中文- Manufacturer：
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- CUI Devices (3)
- Ohmite (4)
- Attachment Method：
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- Material：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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12 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | EXTRUDED HEATSIN... |
|
656
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK TO-3 PWR... |
|
353
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK TO-3 HOR... |
|
323
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
3,230
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
1,118
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
999
In-stock
|
Details Buy Now | ||
|
|
Ohmite | EXTRUDED HEATSIN... |
|
142
In-stock
|
Details Buy Now | ||
|
|
Ohmite | EXTRUDED HEATSIN... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Ohmite | EXTRUDED HEATSIN... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 BL... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 DU... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK FOR MET... |
0.000
|
35,000
In-stock
|
Details Buy Now |
