Русский язык
简体中文- Manufacturer：
-
- CTS Corporation (1)
- CUI Devices (3)
- DFRobot (2)
- Seeed (1)
- Attachment Method：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Product Status：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
3,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
2,000
In-stock
|
Details Buy Now | ||
|
|
Micro Connectors, Inc. | COOLING FAN/HS - R... |
|
500
In-stock
|
Details Buy Now | ||
|
|
DFRobot | PURE COPPER HEAT... |
|
45
In-stock
|
Details Buy Now | ||
|
|
DFRobot | RASPBERRY PI COP... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Seeed | ACTIVE HEAT SINK... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK DPAK SM... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CTS Corporation | HEATSINK PRESS O... |
0.000
|
35,000
In-stock
|
Details Buy Now |
