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简体中文- Manufacturer：
-
- CUI Devices (13)
- iWave Systems (3)
- Ohmite (12)
- Seeed (1)
- Wakefield Thermal (21)
- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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56 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
15,288
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
|
144
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
|
236
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
|
77
In-stock
|
Details Buy Now | ||
|
|
Seeed | ALUMINUM HEATSIN... |
|
252
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
3,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
2,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
2,987
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
2,355
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
2,657
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
2,577
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
2,713
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
2,992
In-stock
|
Details Buy Now | ||
|
|
NTE Electronics, Inc. | HEAT SINK-PLAST. ... |
|
172
In-stock
|
Details Buy Now | ||
|
|
NTE Electronics, Inc. | HEATSINK FOR PLA... |
|
532
In-stock
|
Details Buy Now | ||
|
|
NTE Electronics, Inc. | HEAT SINK-TO-3 TRA... |
|
1,072
In-stock
|
Details Buy Now | ||
|
|
NTE Electronics, Inc. | HEAT SINK |
|
26
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
|
84
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
|
86
In-stock
|
Details Buy Now | ||
|
|
Ohmite | ALUMINUM EXTRUSI... |
|
47
In-stock
|
Details Buy Now |
