Русский язык
简体中文- Manufacturer：
-
- CUI Devices (1)
- Material Finish：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
3 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
|
534
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK TO-220 4.4W... |
|
35,000
In-stock
|
Details Buy Now |
