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简体中文- Manufacturer：
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- CUI Devices (1)
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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3 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, BGA, 10 ... |
|
3,205
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
|
319
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X9.5M... |
|
35,000
In-stock
|
Details Buy Now |
