Русский язык
简体中文- Manufacturer：
-
- CTS Corporation (1)
- CUI Devices (2)
- Attachment Method：
-
- Material：
-
- Package Cooled：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Natural：
-
6 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
|
275
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
2,215
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
3,230
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEAT SINK 30MM X 30... |
|
95
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK 30X30X14.5M... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CTS Corporation | HEAT SINK FORGED... |
|
35,000
In-stock
|
Details Buy Now |
