Русский язык
简体中文- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Type：
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8 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
|
1,037
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK POWER T... |
|
489
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-3 BLA... |
|
825
In-stock
|
Details Buy Now | ||
|
|
Aavid | HEATSINK TO-3 H31.7... |
|
359
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-3 BLA... |
|
272
In-stock
|
Details Buy Now | ||
|
|
Ohmite | BGA HEATSINK W/TA... |
|
2
In-stock
|
Details Buy Now | ||
|
|
Aavid | BOARD LEVEL HEAT... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Aavid | BOARD LEVEL HEAT... |
0.000
|
35,000
In-stock
|
Details Buy Now |
