Русский язык
简体中文- Manufacturer：
-
- CTS Corporation (1)
- CUI Devices (1)
- Ohmite (1)
- Attachment Method：
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- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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8 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEAT SINK, EXTRUS... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Ohmite | HEATSINK BLACK A... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CTS Corporation | HEAT SINK FORGED... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEAT SINK ELLIP F... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEAT SINK PIN FIN... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
TE Connectivity AMP Connectors | HS ASSY CLIP |
0.000
|
35,000
In-stock
|
Details Buy Now |
