Русский язык
简体中文- Manufacturer：
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- CUI Devices (4)
- Material：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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7 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
|
4,888
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
|
3,510
In-stock
|
Details Buy Now | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-263 CO... |
|
118,038
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK, STAMPI... |
|
1,957
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
|
300
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
|
35,000
In-stock
|
Details Buy Now |
