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HSB23-232325
- Mfr.Part #
- HSB23-232325
- Manufacturer
- CUI Devices
- Package/Case
- -
- Datasheet
-
HSB23-232325
- Description
- HEAT SINK, BGA, 23 X 23 X 25 MM
- Stock
- 1202
- Quality
-
- Manufacturer :
- CUI Devices
- Product Category :
- Thermal - Heat Sinks
- Attachment Method :
- Adhesive
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- BGA
- Power Dissipation @ Temperature Rise :
- 6.13W @ 75°C
- Product Status :
- Active
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 3.80°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 12.23°C/W
- Type :
- Top Mount
- Datasheets
- HSB23-232325
All the parts ready to ship will be in anti-static bag. It's indispensable to ship with ESD antistatic protection.
We will have our label attached on ESD packing and the label includes Part Number, Manufacturer and Quantity., etc
Our QC staff would inspect and ensure the parts are new original in accordance with datasheet.
Before delivery our warehouse staff would re-check the parts and ensure the shipment with good condition.
After all the inspections, our logistics department staff will have the packing well and agrrange the delivery.
Currently, we ship through DHL, FedEx, TNT and UPS., etc
Shipping cost starts at $20, but it depends on which country you ship to and what shipping methods you choose.
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.
The EDT depends on the shipping methods you choose.
The tracking number is available for you as soon as we arrange the pick-up.
You can get the tracking information with the tracking number.
Please get in touch with us if any issues with the tracking.
| Global Express | |||
|---|---|---|---|
| Express Delivery | Global delivery 3-5 working days. |  |  |
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Our QC department staff would inspect and ensure all of the parts from CHINA RICH are new & original in accordance with original manufacturer datasheet.
We have an excellent and complete test procedure for all of the parts ready to be out of our warehouse before delivery.
The test report that required by customers are always available.
We focus on products and value-added services for automotive, communications, medical, security, military, and consumer electronic industry.
And we provide cost-effective & competitive solutions and services ranging from state of the art technologies to consumer electronics.
Through our worldwide network from OEMs, original manufacturers, franchised distributors we're able to cover a wide range of application solutions.
Basic Instructions
Welcome to icLinke.com purchasing HSB23-232325, here you can find HSB23-232325, various types and values of electronic parts from the world's leading manufacturers. The HSB23-232325 component of icLinke.com is carefully chosen, undergo stringent quality control, and successfully meet all required standards. icLinke.com has international certificate of ISO 9001 quality management system, provide professional electronic component of HSB23-232325, icLinke.com guarantees that HSB23-232325 is 100% original from CUI Devices , HSB23-232325 provide 365 days warranty, with fastest transportation service. The HSB23-232325 part manufactured by CUI Devices is available for purchase at icLinke.com. Please find package / case of HSB23-232325 on the specifications sheet, product status of HSB23-232325 is Active marked on icLinke.com. HSB23-232325 has 1202 pieces in stock at icLinke.com, the fastest shipping date for HSB23-232325 is within 3 days. When you purchase HSB23-232325, icLinke.com provide variety of payment methods. For more information about HSB23-232325, or the price of HSB23-232325, please send RFQ to us. icLinke.com will reply best price for HSB23-232325, also you can download datasheet to view all details of HSB23-232325, Thank you!
| Part | Manufacturer | Stock | Description |
|---|---|---|---|
| HSB20-353525 | CUI Devices | 35,000 | HEAT SINK, BGA, 35 X 35 X 25 MM |
| HSB21-454515 | CUI Devices | 35,000 | HEAT SINK, BGA, 45 X 45 X 15 MM |
| HSB22-606010 | CUI Devices | 35,000 | HEAT SINK, BGA, 60 X 60 X 10 MM |
| HSB226STL-E | Intersil (Renesas Electronics Corporation) | 32,500 | SCHOTTKY BARRIER DIODE |
| HSB226WKTL-E | Intersil (Renesas Electronics Corporation) | 14,230 | RECTIFIER DIODE, SCHOTTKY |
| HSB24-252510 | CUI Devices | 1,358 | HEAT SINK, BGA,25 X 25 X 10 MM |
| HSB25-282810 | CUI Devices | 1,704 | HEAT SINK, BGA, 28.5 X 28.5 X 10 |
| HSB26-343408 | CUI Devices | 1,194 | HEAT SINK, BGA, 33.5 X 33.5 X 8 |
| HSB27-434316 | CUI Devices | 1,081 | HEAT SINK, BGA, 43.1 X 43.1 X 16 |
| HSB276ASTL-E | Intersil (Renesas Electronics Corporation) | 3,000 | SCHOTTKY BARRIER DIODE |
