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HSB07-202009
- Mfr.Part #
- HSB07-202009
- Manufacturer
- CUI Devices
- Package/Case
- -
- Datasheet
-
HSB07-202009
- Description
- HEAT SINK, BGA, 20 X 20 X 9 MM
- Stock
- 35000
- Quality
-
- Manufacturer :
- CUI Devices
- Product Category :
- Thermal - Heat Sinks
- Attachment Method :
- Adhesive
- Diameter :
- -
- Material :
- Aluminum Alloy
- Material Finish :
- Black Anodized
- Package Cooled :
- BGA
- Power Dissipation @ Temperature Rise :
- 3.1W @ 75°C
- Product Status :
- Active
- Shape :
- Square, Pin Fins
- Thermal Resistance @ Forced Air Flow :
- 8.60°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 24.08°C/W
- Type :
- Top Mount
- Datasheets
- HSB07-202009
All the parts ready to ship will be in anti-static bag. It's indispensable to ship with ESD antistatic protection.
We will have our label attached on ESD packing and the label includes Part Number, Manufacturer and Quantity., etc
Our QC staff would inspect and ensure the parts are new original in accordance with datasheet.
Before delivery our warehouse staff would re-check the parts and ensure the shipment with good condition.
After all the inspections, our logistics department staff will have the packing well and agrrange the delivery.
Currently, we ship through DHL, FedEx, TNT and UPS., etc
Shipping cost starts at $20, but it depends on which country you ship to and what shipping methods you choose.
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.
The EDT depends on the shipping methods you choose.
The tracking number is available for you as soon as we arrange the pick-up.
You can get the tracking information with the tracking number.
Please get in touch with us if any issues with the tracking.
| Global Express | |||
|---|---|---|---|
| Express Delivery | Global delivery 3-5 working days. |  |  |
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Our QC department staff would inspect and ensure all of the parts from CHINA RICH are new & original in accordance with original manufacturer datasheet.
We have an excellent and complete test procedure for all of the parts ready to be out of our warehouse before delivery.
The test report that required by customers are always available.
We focus on products and value-added services for automotive, communications, medical, security, military, and consumer electronic industry.
And we provide cost-effective & competitive solutions and services ranging from state of the art technologies to consumer electronics.
Through our worldwide network from OEMs, original manufacturers, franchised distributors we're able to cover a wide range of application solutions.
Basic Instructions
Welcome to icLinke.com purchasing HSB07-202009, here you can find HSB07-202009, various types and values of electronic parts from the world's leading manufacturers. The HSB07-202009 component of icLinke.com is carefully chosen, undergo stringent quality control, and successfully meet all required standards. icLinke.com has international certificate of ISO 9001 quality management system, provide professional electronic component of HSB07-202009, icLinke.com guarantees that HSB07-202009 is 100% original from CUI Devices , HSB07-202009 provide 365 days warranty, with fastest transportation service. The HSB07-202009 part manufactured by CUI Devices is available for purchase at icLinke.com. Please find package / case of HSB07-202009 on the specifications sheet, product status of HSB07-202009 is Active marked on icLinke.com. HSB07-202009 has 35000 pieces in stock at icLinke.com, the fastest shipping date for HSB07-202009 is within 3 days. When you purchase HSB07-202009, icLinke.com provide variety of payment methods. For more information about HSB07-202009, or the price of HSB07-202009, please send RFQ to us. icLinke.com will reply best price for HSB07-202009, also you can download datasheet to view all details of HSB07-202009, Thank you!
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|---|---|---|---|
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| HSB03-141406 | CUI Devices | 3,326 | HEAT SINK, BGA, 14 X 14 X 6 MM |
| HSB04-171706 | CUI Devices | 35,000 | HEAT SINK, BGA, 17 X 17 X 6 MM |
| HSB05-171711 | CUI Devices | 35,000 | HEAT SINK, BGA, 17 X 17 X 11.5 M |
| HSB06-181810 | CUI Devices | 780 | HEAT SINK, BGA, 18 X 18 X 10 MM |
