Русский язык
简体中文- Manufacturer：
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- CUI Devices (2)
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK DC/DC HA... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Wakefield Thermal | HEATSINK BXB50,75,1... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK HALF BR... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
CUI Devices | HEATSINK HALF BR... |
0.000
|
35,000
In-stock
|
Details Buy Now |
