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简体中文- Manufacturer：
-
- Aavid (5)
- AMEC Thermasol (7)
- CUI Devices (1)
- Seeed (2)
- T-Global Technology (30)
- Attachment Method：
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- Material Finish：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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50 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
T-Global Technology | PH3N 100X100X0.07MM W/... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
TE Connectivity AMP Connectors | H SINK/CLIP ASSEM... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
TE Connectivity AMP Connectors | H SINK/CLIP ASSEM... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
T-Global Technology | XL25 CERAMIC W/BUM... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
T-Global Technology | CERAMIC HEAT SPR... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Seeed | RASPERRY PI COPP... |
0.000
|
35,000
In-stock
|
Details Buy Now | ||
|
|
Seeed | RPI HEAT SINK KIT... |
0.000
|
35,000
In-stock
|
Details Buy Now |
