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简体中文- Manufacturer：
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- Brainboxes (1)
- Seeed (1)
- Attachment Method：
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- Material Finish：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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4 Records
| Image | Part | Manufacturer | Description | Price | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Seeed | HEAT SINK KIT FOR... |
|
1,324
In-stock
|
Details Buy Now | ||
|
|
OSEPP Electronics | RASPBERRY PI LOW... |
|
605
In-stock
|
Details Buy Now | ||
|
|
OSEPP Electronics | RASPBERRY PI TAL... |
|
565
In-stock
|
Details Buy Now | ||
|
|
Brainboxes | RASPBERRY PI COM... |
|
24
In-stock
|
Details Buy Now |
